Data center servers, powerful smartphones, and your computer's motherboard have one thing in common. When these devices get ...
Market demand and global sustainability goals are encouraging HVAC/R manufacturers to innovate with more energy-efficient and environmentally responsible systems. To meet these evolving standards, ...
Design engineers are rethinking cooling strategies from the ground up as the data center industry evolves to meet surging demands driven by AI computing and 24/7 uptime. Among the most impactful ...
UCLA researchers identify a metal with ~3× the heat conduction of copper, offering a potential leap in cooling for chips, AI accelerators, and next-gen electronic systems.
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Newly discovered metallic material with record thermal conductivity upends assumptions about heat transport limits
A UCLA-led, multi-institution research team has discovered a metallic material with the highest thermal conductivity measured among metals, challenging long-standing assumptions about the limits of ...
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