Semiconductor Plating Systems Market to Reach $7.83 Billion by 2030, Dominated by Applied Materials, Solvay, Tokyo Electron

Key market opportunities include the rise of AI-driven manufacturing, growing demand for EVs enhancing use of precise ...
Semiconductor Engineering

MIS Packaging Takes Off

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Business Wire

Unisem Announces QFN Side Wall Plating Capability and Leadframe Grid Array (LFGA) Package Offering

BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
Digi Times

Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors

Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Semiconductor Engineering

Scaling Bump Pitches In Advanced Packaging

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...