> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...