This report characterizes the brain computer interface market, technologies, and players. This includes coverage across non-invasive and invasive technologies, comparisons across key technical ...

This report examines the high-performance computing (HPC) and AI hardware markets. Covering 7 key areas of componentry from AI chips to thermal management, including granular market forecasts from ...

本报告提供了对航天器热防护罩的技术展望。基于传统和新兴的热防护罩技术，本报告评估了不同材料与设计。同时，结合空间探索需求，本报告识别了热防护技术的新兴应用机遇，最终形成面向2035年的市场展望。

This report provides critical insight into the fast-growing micro EV industry of electric two-wheelers, three-wheelers, and microcars. IDTechEx's report highlights critical sales trends across all ...

IDTechEx's "Co-Packaged Optics (CPO) 2025-2035" explores technical innovations and packaging trends, analyzing the value chain. It evaluates industry players and forecasts CPO's impact on data center ...

Giving EV batteries a second life maximizes their value, extends their lifetime before recycling, and contributes to a circular battery economy. This IDTechEx report provides forecasts and analyses on ...

本报告深入剖析了数据中心与云端用人工智能芯片的市场趋势、技术体系以及参与者特性。报告内容广泛，不仅涵盖了当前主流及新兴的芯片类型，如gpu（图形处理单元）、cpu（中央处理单元）、定制化ai asic（专用集成电路）以及其他各类ai芯片，还详细梳理了来自40余家芯片设计企业的产品信息。

电池和储能 Subscription Energy Research Subscription Advanced Battery Pack Sensors and Remote Monitoring 2025年-2035年先进锂离子电池：技术、参与者、市场、预测 2025年-2035年人工智能驱动电池技术：技术、创新和机遇 2025年-2035年固定式储能电池：市场、预测、参与者和技术 2024年 ...

As regulations on PFAS in drinking water tighten around the world, it is important to understand the opportunity for PFAS treatment technologies. This report highlights the technology and commercial ...

This report provides a comprehensive analysis of the memory and storage markets, technologies, and key players. It examines three dominant technologies - HDDs, SSDs/NAND, and DRAM - across major ...

随着全球对饮用水中pfas监管力度的持续增强，发掘pfas处理技术的机遇变得愈发重要。本报告深入剖析了当前及新兴的pfas清除技术，以及新兴与成熟的pfas销毁技术的技术与商业成熟度。同时，本报告还探讨了pfas处理技术在关键应用领域，如饮用水处理、afff（水成膜泡沫灭火剂）、垃圾填埋场渗滤液 ...

由IDTechEx发布的《2025年-2035年半导体先进封装》报告对持续发展的半导体封装领域进行了深刻剖析，尤其聚焦于2.5D与3D封装技术的最新进展。该报告不仅研究了当下的技术风向标、行业面临的挑战以及领军企业的突破性成就，还对未来的市场走向进行了预测。