The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...

TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...

The Cutting-Edge Design Scheme Behind HBM3E's Success: Summary SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Summary Intel’s Sanjay Natarajan explores Moore’s Law’s transformative history, emphasizing its focus on cost reduction rather than just transistor doubling. He highlights its role in advancing global ...

Summary The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import ...

Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...

SiC devices, including Schottky diodes and MOSFETs in TSPAK and TOLT packages. TSC reduces thermal resistance by 17%-19%, enhances performance, cuts costs, and minimizes EMI. Ideal for power-dense, ...

The semiconductor laser market is projected to grow from $3.1 billion in 2023 to more than $5 billion in 2029. Yole Group announces a 9% CAGR during this period. This growth ... Semiconductor ...

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion ... Global semiconductor ...

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec presents a new CFET-based standard cell architecture containing two rows of CFETs with ... At an exclusive gathering in ...

Toray Engineering Co.,Ltd has developed the "TRENG-PLP Coater", a high-accuracy coating device for panel level packaging (PLP is an advanced semiconductor packaging ... Semiconductor Packaging News is ...