Mechanical engineer Misagh Daraei shared his insights on the challenges, innovations, and the future of efficiency in ...

A new technical paper titled “Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application” was published by researchers at Seoul National University of Science and ...

Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.

According to a recent survey, over 90% of Interview Kickstart graduates reported improved job prospects within six months of completing their programs. Many experienced significant salary increases ...

With a Master's in Computer Science from Clemson University and extensive experience at leading tech companies, he combines ...

Check out how high power density enhances the efficiency of energy-harvesting wearables and novel wireless-power-transfer ...

Romanian industrial group TeraPlast (BVB: TRP) announced the acquisition of a 51% control stake in Aquatica Experience Group ...

Uninterrupted communication and data processing are essential for data exchange across vast distances. While supporting ...

AI and edge computing are revolutionizing the way manufacturers process data. Traditionally, data processing required sending ...

The outstanding modularity of the platform empowers a broad spectrum of customers, including Independent Power Producers (IPPs), EPC (Engineering, Procurement, and Construction) companies, O&M and ...