Semiconductor Firms Call for EU Chips Act 2.0
In November, ESIA chief Rene Schroeder told Reuters a Chips Act 2.0 would need to consider how to defend European chipmakers' ...
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According to FMI Panel Level Packaging Market Size, Forecast, Analysis and Share Surpass USD 4.0 Billion | 2035, At 5.6% CAGR
The global panel-level packaging market experienced a moderate CAGR of 4.5% from 2020 to 2024, reaching USD 2.2 billion in ...